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TCP100 Thermal Gap Pad

tp100 gap pad

Heat is thermal energy that is transferred between two bodies due to a difference in temperature. Thermal pad heat transfer is the process of increasing the kinetic energy of a material's particles from a material of high temperature to one of lower temperature. It can also be thought of in the opposite direction of cooling an object by slowing down its particles. In addition, the naturally tacky consistency of the material allows for fast and easy assembly without adhesive.

Questions you may have include:

  • How is heat transferred thermal pad by conduction?
  • What is convection?
  • How heat is transferred thermal pad by radiation?


Blow the tables will help you find the thermal pad that best suits your application needs. The thermal pad interface materials selection guide and comparison tables:

Thermal Interface Gap Filler

GP Series TCP100U TCP400 TCP300 TCP250 TCP200 TCP150 TCP080
Form Gap Filler Pad Gap Filler Pad Gap Filler Pad Gap Filler Pad Gap Filler Pad Gap Filler Pad Gap Filler Pad
Polymer Silicone / Ceramic Silicone / Ceramic Silicone / Ceramic Silicone / Ceramic Silicone / Ceramic Silicone / Ceramic Silicone / Ceramic
Color Brown-Red Shallow Blue Bright Blue Bright Yellow Dark Gray Dark Gray Gray
Thickness (mm) 0.25 - 5.0 0.5 - 5.0 0.5 - 5.0 0.5 - 5.0 0.5 - 5.0 0.5 - 5.0 0.25 - 5.0
Density (g/cc) 2.5 3.15 2.7 2.93 2.79 2.5 2.2
Thermal Conductivity (W/m-K) 1.0 4.0 3.0 2.5 2.0 1.5 0.8
Sheet Stock Yes Yes Yes Yes Yes Yes Yes
Fabrication Die cut Die cut Die cut Die cut Die cut Die cut Die cut
Multilayer Capable 0.5mm up 0.5mm up 0.5mm up 0.5mm up 0.5mm up 0.5mm up 0.5mm up
Ultra Soft Min. Thickness 0.25mm up 0.5mm up 0.5mm up 0.5mm up 0.5mm up 0.5mm up 0.25mm up
Electric Insulation High Low Low Low High High High

 

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